This document specifies test requirements for PB-free Subassembly Modules. Examples of these include, but are not limited to, power supply modules and optics modules that are later added to a higher level assembly. This document exclusively focus on those Restrictions of Hazardous Substances (RoHS) items specific to the introduction of Pb-free components and does not address requirements for device specific qualifications.
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Test Requirements for Pb-Free Subassembly Modules
The Alliance for Telecommunications Industry Solutions , 07/15/2014
Pages: 12
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