Cross References: IEC 60191-6:1990*IEC 60191-6-5*
Original price was: $293.75.$146.00Current price is: $146.00.
BS EN 60191-6-17. Mechanical standardization of semiconductor devices. Part 6-17. Design guide for stacked packages and individual stackable packages. Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA)
BSI Group , 06/19/2007
Pages: 26
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