Cross References:IEC 60068-2-1:1990IEC 60068-2-81:2003IEC 60721-2-1:1982IEC 60721-3-0:1984IEC 60721-3-1:1997 IEC 60747-1:1983IEC 60747-14-1:2000IEC 60749-1:2002ISO/IEC GUIDE 2:2004
Original price was: $117.75.$58.00Current price is: $58.00.
BS EN 62047-9. Semiconductor devices. Micro-electromechanical devices. Part 9. Wafer to wafer bonding strength measurement for MEMS
BSI Group , 12/05/2007
Pages: 11
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