Updated with extended support for components used for lead free assembly! This standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress. It is used to determine which classification level should be used for initial reliability qualification. These devices can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during solder reflow attachment. Developed by IPC and JEDEC.
Original price was: $97.00.$48.00Current price is: $48.00.
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
Association Connecting Electronics Industries , 03/01/2008
Pages: 24
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