This specification has been declared ĀNONCURRENTĀ by the Aerospace Materials Division, SAE, as of May, 2005. It is recommended, therefore, that this specification not be specified for new designs. “NONCURRENTĀ refers to those specifications which have previously been widely used and which may be required for production or processing of existing designs in the future. The Aerospace Materials Division, however, does not recommend these specifications for future use in new designs.
Similar but not necessarily identical product is covered in the following specification. However, this is provided for information only and does not constitute authority to substitute this specification for the ĀNONCURRENTĀ specification: IPC/EIA J-STD-006 Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications, Requirements for
This specification covers a tin-lead alloy in the form of bars, ingots, pellets, ribbon, and round wire.
This solder has been used typically for effecting joints in electrical and electronic circuits where the reliability of the joint requires good control of the purity of the solder, but usage is not limited to such applications.
